See also AMD Athlon Processor Build and Installation Guides (PDF files: Builders Guide for Desktops/Tower Systems)
See also PDF file of AMD faq on Thermal, Hardware, Software Includes links to video's for install of processor, heatsinks, recommended manufacturers of heatsinks, max operating temps.
................................................
Dream System
Processor:
Intel P4 3.2, 3.0, or Extreme Edition w/2 Meg Catch
Prefer:
AMD Athlon 64, 3.2 or 3.0
Chipset:
Required Bus Speed is 266 or 333, not 200
Slot
754
Descrete
graphics, 8x
Certified
for Athlon 64, RAID
See
list below, example:
ASUS
K8r Deluxe, 8xAPG, 3 memory slots, max memory 3 GB, 2 hard drives, 5 PCI, 1x
WiFi slot, 2 IEEE 1394 ports, 4x USB, USB connector gives 4 more.
Power Supply
350 or 400, ATX or ATX12V
UDMA 66/100 cables for Hard Drive (older cables were UDMA
33)
Case Fan
In power supply and one rear of case
front fan not recommended
Should be 88mm
Example: Thermaltake A1214 Varible Speed
CPU Fan
A specfic Athlon64 cooling fan
Example: Foxconn CMA-K8-12
Memory
PC 2700 or 3200 DDRAM (not SDRAM)
At least 512 MEG
Per chipset spec
Video
o Radeon 9800 Pro ($290) has 128 nidddr w/tv DVI
S-video out?
Floppy Drive
Hard Drive
120 to 200 GB, 9-9.4 ms seek, 7200 rpm, 8 meg buffer
CD
512 Buffer memory? 52x?
Supports 640 and 740 mb discs
DVD-R, CD-ROM, CD-R, CD-RW, DVD single and dual
CD Burner
DVD-R, DVD-RW, DVD-ROM, CD-ROM, CD-R, CD-RW
Network
One port for cable modem, one for home network
May use wireless network in future
No mouse, keyboard, printer, scanner, monitor.
Will be useing Intos WACOM graphic tablet, HP 3200 scanner
.......................................
Motherboards for 64 3200
AMD Athlon™ 64 3200+ approved
ATX Form Factor, Any Vendor.
Vendor, Model, Revision, Form Factor, Chipset, Bios
Asus
K8V
1.12 ATX VIA K8T800 AMI
K8V_053
09/05/2003
Biostar
K8NHA Pro
1.0 ATX NVIDIA nForce3 Award
NHA0916 BF Pro
09/16/2003
K8VHA Pro
1.0 ATX VIA K8T800 Award
VHA0910
09/10/2003
Gigabyte
GA-K8N
1.0 ATX NVIDIA nForce3 Award
GA-K8N 1025A
10/24/2003
GA-K8N Pro
1.0 ATX NVIDIA nForce3 Award
GA-K8NP F8F
10/08/2003
GA-K8NNXP
1.0 ATX NVIDIA nForce3 Award
0919e
09/19/2003
GA-K8VNXP
1.0 ATX VIA K8T800 Award
F2H
09/15/2003
GA-K8VT800
Pro
1.0 ATX VIA K8T800 Award
F2d
09/15/2003
K8VT800
1.0 ATX VIA K8T800 Award
F2b
09/04/2003
Leadtek
WinFast K8N
Pro
B ATX NVIDIA nForce3 Award
None
10/21/2003
MSI
K8T Neo
1.0 ATX VIA K8T800 AMI
1.0BH
09/01/2003
........................................
AMD Athlon™ 64 Thermal Solution Guidelines
To enable reliable operation of AMD Athlon™ 64 processor-based systems, the selection of the correct thermal solution is critical. The following heatsink suppliers are those who have developed products designed to support AMD Athlon™ 64 processors. This selection of suppliers is not intended to be a comprehensive listing of all heatsinks that support AMD Athlon™ 64 processors.
Note: This information
is only a guideline for the systems being constructed and is not intended to
be a substitute for system builder verification, validation, and testing on
the reliability and effectiveness of a thermal solution.
Supplier Country Contact Name Contact Title Phone # Email
Ajigo Corporation U.S. Sean Thai US Sales Representative 510-785-9998 sthai@ajigo.com
Taiwan Erick
Shen Taiwan Sales Representative 886-2-2219-0133 eshen@ajigo.com
AVC U.S. Jeff Brown (Thernal-Link) US Sales Representative 310-783-5442 jb@thermo-link.com
Taiwan Sam Chen Product Manager 886-2299-6930 ext.137 sam@avc.com.tw
Taiwan Steve Huang Sales Manager 886-2-2299-6930 ext.120 steve_huang@avc.com.tw
CoolerMaster U.S. Jensen Kuo Sales Manager - US 510-770-8566 jensenk@coolermaster.com
Taiwan Kavin Chang Manager Technical Marketing 886-2-3234-0050 ext. 315 Kavin@coolermaster.com.tw
Taiwan Jerry Chen V.P. OEM/ODM Sales 886-2-3234-0050 ext. 125 jerryc@coolermaster.com.tw
Foxconn U.S. Jack Chen Engineering Manager
714-626-1233 jack.chen@foxconn.com
U.S. Jason Ji Sales Manager - U.S. 714-626-1290 jasonji@foxconn.com
Taiwan & China Heng-Sheng Lin Sales Manager - Taiwan Cell in China : 13686460709
Cell in Taiwan : 0918005011 heng-sheng.lin@foxconn.com
Molex U.S. Aljo Amorelli Associate Product Manager 630-718-5919 Aljo.Amorelli@molex.com
China Jihai Tang Business Unit Manager 86-769-631 0328 JiHai.Tang@molex.com
Thermaltake Technology U.S. David Hwang General Manager 909-598-0098 davidh@thermaltake.com
Taiwan Kenny P.H. Lin General Manager 886-2-26626501 ext. 11 phlin@thermaltake.com
.........................................
AMD Athlon™ 64 Memory Guidelines
In our ongoing efforts to support industry standards, AMD Athlon™ 64 processor-based platforms may be designed to leverage industry standard DDR registered DIMMs. An independent testing company, Computer Memory Test Labs (CMTL), has conducted memory compatibility testing. CMTL is an independent test facility and is able to test RAM modules from different module suppliers. System builders should access the CMTL web site a www.cmtlabs.com and view the recommended memory module list for the specific motherboard manufacturer and motherboard model.
Note: The CMTL website is provided for informational purposes only, and AMD recommends that a system builder conduct its own testing and validation to confirm that the memory modules are suitable for its systems.
Memory Supported
Several AMD Athlon™ 64 processor-based motherboards currently support some of the following memory features:
* PC1600, PC2100,
PC2700 & PC3200 unbuffered memory modules.
* 184-pin 2.5-Volt DDR DIMMs.
* 64-bit DDR memory bus.
* Supports 64-Mbyte, 128-Mbyte, 256-Mbyte, 512-Mbyte, 1-Gbyte, 2-Gbyte and 4-Gbyte
memory technology.
* Supports production DIMMs from industry standard DRAM memory manufacturers.
Only registered-type memory modules should be used.
Need to know type and number of DIMM modules of DDR or SDRAM. Note that some motherboards can only have a maximum of two memory modules installed if unregistered DIMMS are used. If three (or more) memory modules are required, some systems will require that all DIMMS are registered DIMMS.
.........................................
Cooling Guidelines from AMD
Basic Chassis
Selection Guidelines
The following are some basic guidelines to aid in finding an enclosure with
adequate cooling capability:
* Use 80mm fans
or larger.
* Choose a chassis with a fan in the back that is in addition to the CPU fan.
* Cables inside the enclosure can cause airflow disruptions. Tie and route the
cables out of the path of the cooling airflow.
* For tower chassis, choose a chassis with power supplies that have both ATX-style
bottom air intake vents and front air intake vents.
* When the system is in a tower chassis, there must be clear space in front
of the chassis to allow cool airflow in and space behind the chassis for the
heated air to flow out.
* Rear fans should exhaust air in the same direction -- out the back of the
chassis.
* Front intake fans may not be of significant benefit to cooling a tower chassis,
and should not be relied upon as the sole fan in a system.
...............................................
EMI
Shorten the length of the large loop to the power connector as much as possible, by routing the cable in a serpentine manner and tie c plastic twist tie (can reduce emi emissions by 5db). Also rout the fan power cable through the heat sink fins.
The internal power cable can pick up EMI inside the system and can radiate it through the AC power cord. To avoid this, route the internal power cable next to the metal chassis away from the I/O connectors and as far away from the processor heatsink as possible.
Cables inside
the system should be routed along the metal chassis and away from EMI sources,
such as the microprocessor, clock modules, and high-speed VLSI modules.Power
cables for drives should be bundled near the power supply, separate from the
ATX power cable, and away from the processor heatsink. Always route the front
LED cables away from EMI sources, flat to the chassis, and away from the fan
openings. Front USB cables must use a shielded internal cable that is grounded
to the chassis at the I/O connec-tor. Generally, route all cables cleanly and
keep them away from the memory modules. If there are failing signals at 100-,
300-, 500-, or 700-MHz (100/200MHz memory), or 400,
666, or 933 MHz (133/266 MHz memory), the most likely cause is the DIMMs.
The rear plate that touches the rear I/O ports should be made of a metal that has good spring quality, such as stainless steel or spring-hardened steel. Typically, the most vulnerable rear I/O cables are the audio and joystick cables. If EMI emissions drop when these cables are disconnected, then improve the shield-to-chassis grounding for these cables.
Most motherboards have a screw connection between the motherboard ground and the chassis, usually within 20 mm to 40 mm of the processor. EMI tests have shown that in some cases insulating, these motherboard ground-points from the chassis ground can reduce EMI emissions. This solution works because some chassis designs offer lower impedance at high frequency than the material (FR4) that the motherboard is made from.
The fins on the
heatsink may create a waveguide that directs the EMI energy toward the fin ends.
If the processor heatsink is suspected of causing EMI problems, replacing it
with a heatsink with fins running the opposite direction may reduce EMI levels
for that system. In some systems, a ground strap connection to the heatsink
can reduce EMI emissions by
4 dB or more. Typically it is better to ground the heat sink to the power supply
or to a chassis location close to the power supply.
Spread-Spectrum (SS) clocking means the clock signal is intentionally varied to spread the timing clock energy over a small frequency range. Go to the BIOS and make sure this is enabled. Always modulate the spread downward so that the processor never runs above its rated speed.
Verify that the chassis is sealed tightly at all seams; even a paper-thin gap is a problem. Remember that it is the length, not the width, of a gap or seam in the chassis that compro-mises EMI shielding. Empty front drive-bays should have multi-contact EMI shielding covers. Sometimes it is still necessary to add finger-stock material to reduce the length of the gaps between the drive and the chassis when the drive bays are populated. Rivets used on the chassis or power-supply case can also be a problem if they are more than five cen-timeters apart. Too much space between rivets forms a slot antenna. If this condition is suspected, try another brand of power supply with different construction details.
AMD Athlon™ 64 and 64 FX Family Support Components
The following list of component suppliers are those who have developed product to support AMD64 platform processors. This list is not meant to be a comprehensive list of all available supporting components. Please contact the supplier directly for additional product information.
..........................................
Builders Guide
for Desktop/Tower Systems 26003A — May 2002
.1. Ensure the selected motherboard is appropriate for the chosen processor
model and frequency. Check the AMD Athlon™ XP or AMD Duron™ processor
Recommended Motherboards list at
.2. Verify that your case follows the system case (chassis) airflow guidelines
on the AMD website.
.3. Check that the capacity of the power supply is adequate. The individual
voltage capacities must be sufficient for the system power draw. Always calculate
the required power supply capacity (see page 5 of this document) or attempt
to verify compatibility from the power supply manufacturer. An inadequate power
supply will cause a system to be unreliable. Note: Your case design may require
the power supply to be installed before any of the other components.
.4. Wear a grounding strap, and ensure that you are properly grounded at all
times during the system construction, to protect the delicate electronic components
from static electricity damage.
.5. Install the selected hard drive(s), floppy, DVD or CD-ROM player, and other
devices into the chassis. Note: Check the hard drive installation guide. For
full performance, you MUST also install the appropriate data cable as listed
in the hard drive manufacturer’s drive installation instructions.
.6. Remove the motherboard from its protective packaging and place it on a firm
(but not hard) surface. A grounded anti-static pad is the ideal surface.
.7. Remove the processor from its protective packaging (make sure you are electrically
grounded), install the processor into the motherboard socket, then install only
an AMD-recommended heatsink and fan assembly. Use the provided phase-change
thermal material, never use thermal grease. For specific information, follow
the instructions found in the Processor Installation Guide on the AMD website.
.8. Install the standoffs needed to support the motherboard in the case/chassis,
especially where the cards will be placed. Install the assembled motherboard
with processor and heatsink into the cases.
.9. Check the motherboard for any jumper settings. (Most motherboards do not
require jumpers.)
.10. Ensure the selected memory is shown on the motherboard maker’s recommended
memory list (a minimum of 128 Mbytes is recommended). If the motherboard manufacturer
does not have a verified/recommended memory listing, check to see that the memory
supplier has tested your chosen motherboard and deemed it to be compatible with
the RAM memory modules you plan to use.
.11. Install the recommended memory into the motherboard. On some motherboards,
a specific sequence is used to install the memory modules. Always install the
RAM in the sequence required. Verify that each memory DIMM is inserted all the
way into the socket and locked in place.
.12. If there is an AGP slot, install your high-performance AGP video/graphics
card. Have the latest drivers available (see the website of the card maker).
You will need the drivers shortly.
.13. Connect the power cables to the drives and motherboard.
.14. Connect the hard drive, floppy, and DVD (CD-ROM) data cables in the normal
manner. Verify that the cables are installed securely and the colored edge is
by Pin 1 on both the drives and the motherboard.
.15. Connect the monitor data cable, keyboard cable, and mouse cable to the
rear of the system.
.16. Install the AC line power cord on the power supply and connect it to the
power outlet.
.17. Go to the websites of the motherboard vendor or the chipset maker. Check
the vendor's web site for the latest version of the BIOS, AGP miniport driver,
and bus mastering IDE driver. (AMD has drivers available for its chipsets. See
$$$^ ^% .)
.18. Check the peripheral manufacturer's web site for the latest drivers for
the sound card, network interface card, the video graphics card, and any other
added devices.
.19. Power the
system on and begin loading just the minimum software, the OS, and any required
drivers.
.20. Make sure the system starts and runs reliably with just the graphics card
installed. Restart and run the system multiple times. Try to find potential
problems early since there are fewer components to check.
.21. If other cards are to be installed, install them now—one at a time.
Turn off the system and unplug it before installing each card. Restart the system
after every card installation. Note: If you have difficulties with the installation
of any of the cards or drivers, read the AMD technical document entitled Complex
Configurations and IRQ Info, available on the AMD website.
.22. As you install each card, verify the card is properly installed (connector
is fully inserted into the slot, check the front and back) and that the retention
screws are in place.
...........................................
Computer Hardware
> Cases (Computer Cases, ATX Form) > FOXCONN (SUPERCASE/ALLIED) > N82E16811154013
FOXCONN SUPER CASE MID TOWER CASE *BLACK* w/ Front Door & 400W AMD Listed
to Athlon 1400/Athlon XP 2100+ **INTEL Approved Chassis 3Ghz+**
Intel approved and extended chassis w/ Intel Designed Air Duct
Newly designed Release-n-lock Lever for 5.25" devices
Detachable and interchangeable front bezel
Detachable 3.5" hard drive cage
Removable HDD Holder Dimension (DxWxH) 18.4x8.2x17.15 Drive Bays 4+2+3 Motherboard
Micro ATX, ATX up to 10.5X12.5 inches Expansion Slots 7Full Size Switching Power
Supply ATX12V 400W Cooling Fan: Front 2(Optional) Rear One Included 2X Front
USB 2.0 Ideal for P4, AMD and Server systems *Extended chassis -- deeper &
taller *Excellent thermal performance Tambient 38 degree or less w/ P4 3.0G
CPU More...
Intel Thermally Advantage Chassis Link
-OEM
Specifications are subject to change without notice
Detailed Specifications
Model # TU-150
Factory # 7C532-150
Dimension (DxWxH) 18.4 X 8.2 X 17.15
DriAve Bays 4+2+3
Motherboard ATX, Micro ATX
Expansion Slots 7
Switching Power Supply ATX 12V 400W (Intel/AMD listed))
Cooling Fan Rear Included Front Two (Optional)
USB Ports 2 Front USB 2.0
Description *Ready for Intel 3.06 GHz/AMD CPUs
*Intel listed thermally advantaged chassis"
*Chassis air guide
*Tambient less than 38C
*Virtually tool-less
*Release-n-Lock lever for 5 1/4" devices
*Quick-release for 3 1/2" devices
*2 extra removable HDD cages
*2 front USB 2.0 ports
*ATX12V 400W power supply w/ 2 ball bearing thermal fans
.......................................
Specifications
are subject to change without notice
Detailed Specifications
Case Type ATX Mid Tower Chassis
Main Board Size ATX form factors
Drive Bays 4 x 5.25 drive 2 x 3.5 FDD
4 x 1" HDD
Expansion Slots
7 slots
Power Supply PS2 Type Power Supply
W x H x D 7.5" (190mm) x 17.5" (445mm) x 19" (483mm)
Weight 27LBS included power supply
Chassis Metal Material 0.8mm SECC
Front Bezel Material ABS